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2027校招-封装工程师/Packaging Engineer

Texas Instruments

1000+ employees
Location: Chengdu, Sichuan, China · No.8-8 Kexin Road, High-tech Zone(West), Chengdu, CN
Salary Range: Not specified
Source: Lightspeed
Posted: Jul 31, 2026
Found: Oct 15, 2026

Job Description

Department: Not specified

Skills & Keywords

Assembly, Characterization, SPC, Packaging
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