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ADCE Packaging Design Architect

Intel

1000+ employees, Public
Location: US, Arizona, Phoenix · United States of America · US, Oregon, Hillsboro · US, Washington, Multiple Cities · US, New Mexico, Albuquerque · US, Massachusetts, Beaver Brook · US, Colorado, Fort Collins · US, California, Santa Clara · US, California, Folsom ·
Salary Range: Salary range USD 220,920 - 311,890 / year
Source: Lightspeed
Posted: Jun 03, 2026
Found: Oct 15, 2026

Job Description

Department: Not specified

Skills & Keywords

HDL, ANSYS, Creative Solutions, Packaging, Hiring Practices, Assembly, Characterization, Package Design, SIP, Chemical Engineering, SPICE, Compliance, Product Lifecycle Management, Integrated Circuit Design, PCB design, Corporate Social Responsibility
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