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Packaging Module Equipment Development Engineer

Intel

1000+ employees, Public
Location: US, Arizona, Phoenix · United States of America
Salary Range: Salary range USD 99,030 - 188,890 / year
Source: Lightspeed
Posted: Aug 20, 2026
Found: Oct 15, 2026

Job Description

Department: Not specified

Skills & Keywords

Hiring Practices, Semiconductors, Experimental Design, Assembly, Quality Systems, Research, Troubleshooting, SPC, Compliance, Manufacturing Engineering, Materials Science, Packaging, Corporate Social Responsibility
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