Advanced Packaging Module Development Engineer

Intel

1000+ employees, Public
Location: US, Oregon, Hillsboro · United States of America
Salary Range: Salary range USD 133,800 - 255,200 / year
Source: Lightspeed
Posted: Sep 25, 2026
Found: Oct 15, 2026

Job Description

Department: Not specified

Skills & Keywords

Enablement, Experimental Design, Actionable Insights, Compliance, Process Integration, Chemistry, Materials Science, Attention to Detail, Automation, Experimentation, Hiring Practices, Semiconductor Devices, Robotics, Python, SPC, Automation Systems, Packaging, Corporate Social Responsibility, Matlab, Opto-Mechanical, Physics, Chemical Engineering, Statistical Analysis, Metrology, Semiconductors, Feasibility Studies, Image Processing, Cross-functional Team Leadership, Project Management, System Design, Material Selection
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