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Wire Bond & Die Attach Equipment Engineer (MES Project)

Texas Instruments

1000+ employees
Location: Wilayah Persekutuan Kuala Lumpur, Malaysia · 1, Lorong Enggang 33, Ampang, Kuala Lumpur, MY
Salary Range: Not specified
Source: Lightspeed
Posted: Sep 28, 2026
Found: Oct 15, 2026

Job Description

Department: Not specified

Skills & Keywords

Automation, Written Communication Skills, Project Delivery, Physics, Chemical Engineering, SPC, Materials Science, Modeling, Maintenance
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