Packaging Module Development Engineer

Intel

1000+ employees, Public
Location: Malaysia, Kulim · Malaysia
Salary Range: Not specified
Source: Lightspeed
Posted: Oct 07, 2026
Found: Oct 15, 2026

Job Description

Department: Not specified

Skills & Keywords

Root Cause Analysis, PCBA, Quality Assurance, Compliance, Process Integration, Materials Science, Processes Development, Analytics, Hiring Practices, Product Requirements, Failure Analysis, SPC, Integrated Circuit Design, Packaging, Corporate Social Responsibility, Optics, Characterization, Scalability, Physics, CTF, Chemical Engineering, Town Halls/Forums, PCB design, Cross-functional Team Leadership, Process Optimization
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