Silicon Packaging Design Architect
Intel
1000+ employees, PublicJob Description
Department: Not specified
Skills & Keywords
Software Development Processes, Package Design, Troubleshooting, SIP, 3D, Compliance, SPICE, Materials Science, ANSYS, Hiring Practices, Product Requirements, Organization Skills, Integrated Circuit Design, Packaging, Corporate Social Responsibility, Assembly, Characterization, Chemical Engineering, PCB design, HDL, Research, Cross-functional Team Leadership, EDA
If you see something wrong with this job listing after clicking 'Apply Now', you can:
flag it as expired
flag it as expired
Similar Jobs You Might Like
More Jobs at Intel
AI Software Engineering Intern
China · Beijing · Shanghai, China
Senior Financial Analyst
Vietnam
Facilities Chemical Intern
Malaysia