Career Accelerator Program - Packaging Engineer - PhD
Texas Instruments
1000+ employeesJob Description
Department: Not specified
Skills & Keywords
Package Design, AutoCAD, 3D, Stress Analysis, Thermodynamics, Project Delivery, Heat Transfer, Thin Films, Packaging, Modeling, MEMS, Optics, PVD, Characterization, vi, Surface Treatment, Research, Cardiovascular Disease, Machine Learning
If you see something wrong with this job listing after clicking 'Apply Now', you can:
flag it as expired
flag it as expired
Similar Jobs You Might Like
More Jobs at Texas Instruments
Senior Digital Design Engineer | HSC
Fort Collins, Colorado Area
Digital Design Manager
Bangalore · Bengaluru, Karnataka, India
Analog Field Applications Engineer (Auto BMS)
Korea · Seoul, Korea
Software Development Engineer
United States · Dallas, Texas